CMP Filtration Solutions

Chemical Mechanical Planarization (CMP) is a polishing process used in the semiconductor industry for manufacturing wafers. It is a technology in the fabrication process of semiconductor devices that involves the use of chemical corrosion and mechanical force to flatten silicon wafers or other substrate materials. CMP solutions have improved the process of creating multilayer semiconductor circuits. The slurry used for chemical polishing is generally referred to as a grinding fluid or slurry. Due to chemical instability and processing steps, gels and agglomerates slowly form in the slurry, and these large particles are transported to the surface of the wafer, causing defects such as micro-scratches on the wafer surface and resulting in significant loss of wafer yield. Therefore, CMP filtration is crucial for removing defects that cause large particles and agglomeration without affecting the polishing performance. The transportation system is shown below: